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No substrate conductive/thermal tape


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Product Description

Product Features

High retention, good chemical resistance, electrical conductivity and bending resistance;

The thermal conductive tape adapts to a wide range of temperature changes in the working environment, can fill uneven surfaces, and fully export the heat source on the electronic components;

 

Applications

Mainly used for EMI/RFI shielding, conduction and electrostatic discharge;

It is suitable for the pasting of membrane panel switches, nameplate/logo connection, microphone mesh and filter bonding, metal/polyester cover bonding, and shock-proof foam bonding;